Yozbatiran, N., Keser, Z., Hasan, K., Stampas, A., Korupolu, R., Kim, S., O’Malley, M.K., Fregni, F. and Francisco, G.E. (2017). White matter changes in corticospinal tract associated with improvement in arm and hand functions in incomplete cervical spinal cord injury: pilot case series. Spinal Cord Series and Cases, 3,
Yozbatiran, N., Der-Yeghiaian, L., & Cramer, S. C. (2008). A standardized approach to performing the action research arm test. Neurorehabilitation and neural repair, 22(1), 78-90.
Agarwal, P., & Deshpande, A. D. (2015, August). Impedance and force-field control of the index finger module of a hand exoskeleton for rehabilitation. In Rehabilitation Robotics (ICORR), 2015 IEEE International Conference on (pp. 85-90). IEEE.
Agarwal, P., Yun, Y., Fox, J., Madden, K., & Deshpande, A. D. (2017). Design, control, and testing of a thumb exoskeleton with series elastic actuation. The International Journal of Robotics Research, 36(3), 355-375.
Agarwal, P., & Deshpande, A. D. (2017, May). A novel framework for optimizing motor (Re)-learning with a robotic exoskeleton. In Robotics and Automation (ICRA), 2017 IEEE International Conference on (pp. 490-497). IEEE.
Yun, Y., Esmatloo, P., Serrato, A., Merring, C. A., & Deshpande, A. D. (2017, July). Methodologies for determining minimal grasping requirements and sensor locations for sEMG-based assistive hand orthosis for SCI patients. In Rehabilitation Robotics (ICORR), 2017 International Conference on (pp. 746-752). IEEE.
Yun, Y., Dancausse, S., Esmatloo, P., Serrato, A., Merring, C. A., Agarwal, P., & Deshpande, A. D. (2017, May). Maestro: An EMG-driven assistive hand exoskeleton for spinal cord injury patients. In Robotics and Automation (ICRA), 2017 IEEE International Conference on (pp. 2904-2910). IEEE.
Kuo, P. H., & Deshpande, A. D. (2010, September). Contribution of passive properties of muscle-tendon units to the metacarpophalangeal joint torque of the index finger. In Biomedical Robotics and Biomechatronics (BioRob), 2010 3rd IEEE RAS and EMBS International Conference on (pp. 288-294). IEEE.